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| (R) STPS0530Z SCHOTTKY RECTIFIERS MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM VF (max) 0.5 A 30 V 0.33 V FEATURES AND BENEFITS s s s VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING DESCRIPTION Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits GSM and PCMCIA requirements. SOD-123 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM dV/dt Tstg Tj TL *: RMS forward current Average forward current =0.5 Surge non repetitive forward current Critical rate of rise of reverse voltage Storage temperature range Maximum operating junction temperature * Maximum temperature for soldering during 10s Ta=55C tp=10ms sinusoidal Parameter Repetitive peak reverse voltage Value 30 2 0.5 5.5 10000 - 65 to + 125 125 260 Unit V A A A V/s C C C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) March 2003 - Ed : 1A 1/5 STPS0530Z THERMAL RESISTANCE Symbol Rth (j-a) Junction to ambient Parameter Value 340 * Unit C/W (*) Copper area on PCB S = 2.5mm STATIC ELECTRICAL CHARACTERISTICS Value Symbol Parameter Tests conditions STPS0530Z typ. IR * Reverse leakage current Tj = 25C Tj = 125C Tj = 25C Tj = 125C VF ** Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj=125C Pulse test : * tp = 5 ms, < 2% ** tp = 380 s, < 2% Unit max. 12 A mA A mA V VR = 15 V 3 VR = VRRM 9 IF = 0.1 A 0.20 IF = 0.5 A 0.31 5 130 21 0.375 0.22 0.43 0.33 To evaluate the maximum conduction losses use the following equation : P = 0.23 x IF(AV) + 0.18 x IF2(RMS) 2/5 STPS0530Z Fig. 1: Conduction losses versus average current. PF(AV)(W) 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 T Fig. 2: Average forward current versus ambient temperature ( = 0.5) IF(AV)(A) 0.55 0.50 0.45 = 0.05 = 0.1 = 0.2 = 0.5 =1 0.40 0.35 0.30 0.25 0.20 0.15 0.10 Rth(j-a)=340C/W S=2.5mm 0.04 0.02 0.00 0.0 0.1 0.2 0.3 0.4 IF(AV)(A) =tp/T 0.5 0.05 tp Tamb(C) 0 25 50 75 100 125 0.00 0.6 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 4.0 3.5 3.0 2.5 2.0 1.5 Tamb=25C Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration. Zth(j-a)/Rth(j-a) 1.0E+00 = 0.5 = 0.2 = 0.1 1.0E-01 1.0E-02 1.0 IM Tamb=50C Single pulse Tamb=75C T 0.5 0.0 1.E-03 t =0.5 t(s) 1.0E-03 1.E-02 1.E-01 1.E+00 tp(s) 1.E-03 1.E-02 1.E-01 1.E+00 =tp/T 1.E+01 tp 1.E+02 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) 1.E+01 Tj=125C Fig. 6: Reverse leakage current versus junction temperature (typical values). IR(mA) 1.E+01 VR=30V 1.E+00 Tj=100C 1.E+00 Tj=75C 1.E-01 Tj=50C 1.E-01 1.E-02 Tj=25C 1.E-02 VR(V) 1.E-03 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 1.E-03 0 25 50 Tj(C) 75 100 125 3/5 STPS0530Z Fig. 7: Junction capacitance versus reverse voltage applied (typical values). C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C Fig. 8: Forward voltage drop versus forward current. IFM(A) 2.0 1.8 1.6 1.4 1.2 Tj=125C (Typical values) Tj=25C (Maximum values) Tj=125C (Maximum values) 100 1.0 0.8 0.6 0.4 VR(V) 10 1 10 100 0.2 0.0 0.00 0.10 0.20 0.30 VFM(V) 0.40 0.50 0.60 0.70 0.80 Fig. 9: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, Cu=35m, typical values). Rth(j-a)(C/W) 350 300 250 200 150 100 50 S(mm) 0 0 10 20 30 40 50 60 70 80 90 100 4/5 STPS0530Z PACKAGE MECHANICAL DATA SOD-123 H b E DIMENSIONS A2 A1 REF. Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0 Inches Min. Max. 0.057 0.004 0.053 0.033 A A1 D A A2 b c D E G H 0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7 0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067 c G FOOTPRINT (in millimeters) 4.45 0.65 0.97 2.51 0.97 MARKING Type STPS0530Z s Marking Z53 Package SOD-123 Weight 0.01g. Base qty 3000 Delivery mode Tape & reel s Epoxy meets UL94, V0. Band indicates cathode. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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